SOLDER WIRE GR-30/70 SWG-16

30/70 Tin-Lead Solder Wire, 16 SWG, 1 kg

The Chetna Solder 30/70 Tin-Lead Solder Wire is designed for electrical and electronic soldering applications where a 30/70 tin-lead alloy is specified or permitted. Supplied on a convenient 1 kg reel, it provides a substantial supply of solder wire for regular assembly, maintenance, servicing and repair work.

The 30/70 Sn/Pb alloy contains 30% Tin and 70% Lead, making the alloy composition clearly identifiable for applications that require this specific solder grade. The wire is supplied in 16 SWG size and features a single internal no-clean flux core, combining solder alloy and flux in one convenient wire for controlled feeding during the soldering process.

The integrated flux helps with surface oxide removal and solder wetting when the joint is heated, supporting the formation of a suitable solder connection on compatible surfaces.

Key Features

1. 30/70 Tin-Lead Alloy: Contains 30% Tin and 70% Lead (Sn/Pb) for applications requiring this specific alloy composition.
2. 16 SWG Wire: A relatively substantial wire size, suitable for joints where an appropriate amount of solder is required. For smaller or fine connections, a thinner wire may provide better control.
3. Single No-Clean Flux Core: Flux is incorporated inside the solder wire to assist with oxide removal and solder wetting during soldering.
4. Convenient Flux-Cored Design: Solder and flux are delivered together through the same wire, simplifying solder application.
5. 1 kg Reel: Provides a substantial quantity for repeated soldering work in workshops, assembly areas, service centres and repair environments.
6. Electrical & Electronic Applications: Labelled for soldering electrical and electronic instruments and equipment, subject to compatibility with the specific application.

Product Specifications

Applications

This solder wire is suitable for electrical and electronic assembly, equipment servicing, maintenance, repair and general workshop soldering where a 30/70 Sn/Pb alloy and the specified flux are appropriate.

Select the solder wire according to the joint size, component type, surface materials and required solder volume. The 16 SWG size may be useful where more solder is required per joint, while finer wire can offer greater control for smaller connections.

For reliable soldering, heat the compatible joint and mating surfaces adequately, feed the solder into the heated joint, and allow the connection to cool without movement.

Important Safety Information

This product contains lead. Use suitable ventilation or fume extraction during soldering, avoid unnecessary contact with solder residues, and wash hands thoroughly after handling. Follow the manufacturer's safety instructions and applicable workplace requirements.

The “No-Clean” designation does not mean that every application can automatically leave flux residue untreated. Follow the manufacturer's recommendations and the cleanliness requirements of the particular assembly.

Where your application requires lead-free solder, select an appropriate lead-free solder alloy instead.